[請益] MmNRP軟韌體/IC部門請益
大家好,本人大學期間曾修習過FPGA實作專題,也有Arduino開發經驗,將來希望能進入
ㄧ線IC廠工作,目前正在選擇研所WLAN/LTE或IC領域
小弟比較想往軟韌體走,想請問大家,若是走RTL design會比SW/FW更難進嗎?
個人認為因Tape out成本巨大,在晶片設計的部門便需要是很專精的人,且要以高分紅綁
住人才,相較之下人數也較軟韌體少(104職缺數)且為主力產品,因此年薪也較優?
本人認為SW/FW未來彈性較大,但門檻太低而競爭激烈,又覺得若不是主要產品變得有點
像輔助角色,且工時似乎也很高,將來應也是當做跳板(指若從事軟韌體便以外商為目標)
,若兩種方向選擇,有什麼建議嗎,或是有類似工作經歷的大大能分享,謝謝各位!
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