[請益] 台積Process Development Engineer請益

看板Tech_Job作者 (pyche)時間1年前 (2023/05/02 23:03), 1年前編輯推噓8(807)
留言15則, 10人參與, 11月前最新討論串1/1
[代強者我同學po] 各位前輩好, 小弟為四大理工碩一,實驗室做模擬計算的。 前兩天收到台積實習面試邀請,細節如下: -------------------------------------- A. 職務名稱: Process Development Engineer 2023 Intern 工作地點: 中科Taichung Site, 龍潭Longtan B. 職務說明: 1) Develop expertise in advanced TCB bonding related process development 2) Drive development of new technology for semiconductor advanced packaging bonding applications 3) Fundamental studies to validate the mechanism of defects that encountered 4) Work closely and collaborate with equipment suppliers, towards roadmap and schedule alignment 5) Collaborate with equipment engineers to provide and receive feedback on equipment/process interactions C.職務需求: 1) Major in Mechanical Engineering, Materials Science and Engineering and Chemical Engineering related fields. 2) Hands-on participation and a strong sense of ownership are required. 3) Strong technical problem-solving and analytical skills, based upon fundamental and empirical models 4) Excellent teamwork capabilities, able to receive and provide inputs for cross-functional projects 5) Have basic mechanical-related knowledge. Having the semiconductor processes knowledge is a plus. 6) Basic written and spoken communication skills are required. 7) Being able to communicate in Mandarin and English 8) Strong Project management and priority handling skills with self-motivation 9) Have ability to edit code is a plus, such as Python, C#, C++, Matlab ------------------------------ 根據關鍵字,看來是做先進封裝的,似乎很有前途(?), 但好像還是產線缺,484 GG騙人的新手法? 再麻煩知道單位內部工作內容、風氣的前輩多給些資訊,感謝! -- ※ 發信站: 批踢踢實業坊(ptt.cc), 來自: 140.112.229.158 (臺灣) ※ 文章網址: https://www.ptt.cc/bbs/Tech_Job/M.1683039782.A.B3A.html ※ 編輯: cepy (140.112.229.158 臺灣), 05/02/2023 23:04:14

05/02 23:10, 1年前 , 1F
封裝不是IIP都是產線ㄅ
05/02 23:10, 1F

05/02 23:13, 1年前 , 2F
是有啥前途?
05/02 23:13, 2F

05/02 23:19, 1年前 , 3F
你八成化工或化材吧 就去實習阿 不然能去哪
05/02 23:19, 3F

05/02 23:32, 1年前 , 4F
112在那邊四大
05/02 23:32, 4F

05/02 23:41, 1年前 , 5F
都明白寫process了哪來的新手法
05/02 23:41, 5F

05/02 23:46, 1年前 , 6F
實驗室可以放人 就去啊
05/02 23:46, 6F

05/02 23:57, 1年前 , 7F
學弟 112跟人喊啥四大
05/02 23:57, 7F

05/02 23:57, 1年前 , 8F
四大都成大在喊的
05/02 23:57, 8F

05/03 00:38, 1年前 , 9F
罵不然,你才不然,這素質不意外
05/03 00:38, 9F

05/03 05:39, 1年前 , 10F
我們CEO就是因為做這個才被張爺爺拉上去的喔。當初
05/03 05:39, 10F

05/03 05:39, 1年前 , 11F
梁孟松不想做以為被流放就離開了
05/03 05:39, 11F

05/03 05:42, 1年前 , 12F
這明顯研發缺啊.. 研發比產線累啦 但新領域你應該
05/03 05:42, 12F

05/03 05:42, 1年前 , 13F
可以玩的很開心
05/03 05:42, 13F

05/03 12:29, 1年前 , 14F
Thermo-Compression Bonding (TCB)機會很好請把握
05/03 12:29, 14F
謝謝各位大大,忘了說是代po,所以才寫四大~ ※ 編輯: cepy (140.112.229.158 臺灣), 05/03/2023 21:27:13

05/05 17:37, 11月前 , 15F
要會寫程式幹嘛?
05/05 17:37, 15F
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