[請益] 矽品bumping&Flip Chip製程工程師
同學在矽品擔任bumping製程整合工程師(三處九部)
我投履歷之後卻被拉去面試Flip Chip製程(資深)工程師(五處?部)
兩邊皆說缺人,詢問人資我如果要重新面試前者就必須推掉後者的offer
但我曉得得兩者之間的差異性及實際工作內容之類的
詢問蔡姓主管也說得較籠統,只說兩者屬於前後段製程差異
如果我進去是負責作封膠段的製程,bumping同學則是說會負責電鍍部分
上班工時兩者皆說常日班8:15~17:25,不常加班,薪水38K起跳
想請教如果是看未來發展的前景,或是之後想從晶圓代工廠跳晶圓廠
建議做bumping較好還是做Flip Chip呢?
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◆ From: 118.171.162.132
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※ 編輯: lewislin709 來自: 118.171.162.132 (03/16 10:48)
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