[新聞] Sony Z4超薄機身不保?傳驍龍810過熱影響已回收
http://goo.gl/MsvBcK
MoneyDJ新聞 2015-03-10 12:03:26 記者 郭妍希 報導
Sony Corp.不像許多智慧型手機大廠、每年僅會發布一款旗艦機種,相反地該公司是以半
年為新機發表的週期,這也意味著,次世代旗艦智慧型手機「Xperia Z4」應該隨時都可
能問世。不過,Z4卻在最近舉行的世界通信大會(Mobile World Congress;MWC)中缺席,
引發市場關切。
最新謠言顯示,Sony可能正在忙著解決高通(Qualcomm)「驍龍(Snapdragon) 810」處理器
的過熱問題。Phone Arena 9日報導,知名Twitter爆料用戶Ricciolo 7日透露,Sony正在
尋找解決方案,希望能在處理驍龍810的過熱問題之餘,還能保有超薄的機身設計。根據
報導,Xperia Z4理論上應該是全球最薄的旗艦機種。
Sony才剛剛在MWC發表了全球最輕薄的10吋平板電腦「Xperia Z4 Tablet」,其厚度僅
6.1mm、重達389g,雖然這款裝置也是採用驍龍810處理器,但其平面空間比智慧型手機大
上許多、能順利散發熱氣。市場之前就傳出,Sony Z4智慧手機也打算採用「超薄」策略
,厚度不但比自家Xperia Z3薄上許多、且也勝過競爭對手三星Galaxy S6及蘋果iPhone 6
。
心得:
這對索尼來說可是不小的壓力阿,前面兩代的Z2跟Z3為了解熱還採用了熱導管,
可是即便是超薄熱導管在堆疊上還是得佔掉1~2mm的高度,
在這個要不斷競薄的環境下索尼要怎麼同步解決散熱跟變薄呢,
這在後面應該會被很多人關注吧,尤其Z3還算是相當耀眼的前代,
Z4不知道會在哪方面做更往上的提升
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