[新聞] Airgo sampling third gen MIMO WLAN chip
Airgo sampling third gen MIMO WLAN chip
John Walko
(09/14/2005 11:33 H EDT)
URL: http://www.eetimes.com/showArticle.jhtml?articleID=170703136
LONDON — Airgo Networks, Inc. has started sampling its third generation
multiple input – multiple output chipset that is said to support data rates
up to 240Mbit/s.
The device should be in volume production by the end of the year, and will
have full compatibility with the 802.11a/b/g standards. It is being designed
in to routers, laptops and other devices, all of which should be shipping
early next year.
Airgo (Palo Alto, Calif.) is already shipping previous generation devices to
several companies supplying WLAN gear, including Samsung, Linksys, Belkin and
Netgear.
Its technology is set to play a key part in the merging very fast Wirelss LAN
market, for which the IEEE is trying to agree the 802.11n specification.
“When MIMO was first unveiled it reversed over 100 years of scientific
thinking by harnessing natural radio wave distortions, which were previously
perceived as interference, to deliver dramatically increased speed, range and
reliability,” said Greg Raleigh, president and CEO of Airgo Networks. “With
True MIMO Gen3 technology our team has achieved a scientific milestone by
proving that wireless can surpass wired speeds.”
Airgo says tests show that its third generation part provides actual TCP/IP
throughput of over 120Mbit/s with uncompressed traffic, surpassing the
performance of wired 100BaseT Ethernet.
The chipset features a single chip with two complete radios fully integrated
to achieve aggressive board-level integration, which the company says can
lead to a 15 percent reduction in the overall Bill of Material cost and a 20
percent reduction in power consumption.
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