TSMC’s leading 3DIC Technologies
As heterogeneous integration of chiplets becomes increasingly important in ext
ending system scaling, we’ve recently compiled 3 major technology offerings f
rom #TSMC for chiplet integration into what we call Wafer Level System Integra
tion Platform.
Check out the chronological account of these technology evolution as well as t
he latest addition to the platform: https://lnkd.in/etE4BkQ
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※ 發信站: 批踢踢實業坊(ptt.cc), 來自: 114.136.129.83 (臺灣)
※ 文章網址: https://www.ptt.cc/bbs/Tech_Job/M.1570196542.A.D19.html
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