[新聞] 10奈米發威 台積電明年更優
10奈米發威 台積電明年更優
http://www.chinatimes.com/newspapers/20160912000097-260204
台積電10奈米將在年底進入量產階段,據設備業者透露,包括海思、聯發科、高通、蘋果
等4大客戶,預計今年底前可望完成晶片設計定案(tape-out),並且已開始預訂台積電
明年10奈米產能。對台積電來說,明年第1季10奈米就可貢獻營收,
在10奈米產能逐季快速拉升下,營收成長動能強勁,營運表現將明顯優於今年。
另外,台積電7奈米預估明年上半年可完成晶片設計定案,2018年第1季進入量產,目前包
括可程式邏輯閘陣列(FPGA)大廠賽靈思(Xilinx)、繪圖晶片大廠輝達(NVIDIA)兩大
16奈米客戶,已確定跨過10奈米製程世代,直接與台積電在7奈米進行合作。
台積電在中科12吋晶圓廠Fab 15第5期已完成10奈米產能建置,近期試產情況比預期好,
第一個10奈米晶片已達滿意良率,會有3個10奈米晶片已經完成設計定案,而今年底會有
更多晶片完成設計定案,明年第1季可望開始貢獻營收。而台積電持續擴建第6期及第7期
,未來除了支援10奈米生產,也會在2018年將部分產能轉換成7奈米進入量產。
據了解,台積電10奈米客戶中,大陸華為集團旗下的海思半導體動作最為積極,海思的手
機晶片及網路處理器已確定要採用台積電10奈米製程量產,最快今年底就會進入量產。手
機晶片大廠聯發科也加快10奈米微縮計畫,明年推出的Helio X30將採用台積電10奈米進
行量產,最快明年第1季可開始擴大投片。
高通新一代10奈米手機晶片Snapdragon 830仍委由韓國三星代工,但高通跨足ARM架構伺
服器高效能運算(HPC)晶片市場的首款10奈米處理器,卻沒有交給三星生產,而是轉向
委由台積電代工,同樣可望在年底前完成設計定案並導入量產。
再者,蘋果今年採用台積電16奈米製程生產A10 Fusion應用處理器,已經在台積電南科12
吋晶圓廠Fab 14放量生產,下一世代的A11應用處理器幾乎已確定由台積電繼續拿下獨家
代工訂單,而A11預計10月底可完成設計定案,明年第2季開始委由台積電以10奈米製程代
工投片,而且會繼續採用台積電第二代整合扇出型晶圓級封裝(InFO WLP)技術。
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