[新聞] 訂單接不完 台積16奈米加速擴產 - 中時
訂單接不完 台積16奈米加速擴產 - 中時
http://www.chinatimes.com/newspapers/20160328000032-260202
今年台積電除拿下蘋果A10應用處理器獨家代工訂單,也搶下海思、聯發科等手機晶片大
單,16奈米產能已供不應求;儘管南台灣強震影響16奈米鰭式場效電晶體(FinFET)製程
產出,但南科12吋廠Fab14的16奈米擴產仍持續加速。
台積電去年底拿下50個16奈米晶片設計定案(tape-out),今年可望再拿下70個晶片設計
定案,配合精簡型FinFET製程(16FFC)提前在4月進入量產,加上Fab 14第7期新產能將
在下半年快速開出,今年第四季總產能將上看30萬片,成為全球擁有最大FinFET製程邏輯
產能的半導體大廠。
台積電今年將投入90~100億美元資本支出,主要用來擴建16奈米產能。雖然2月南台灣強
震影響晶片產出,但目前所有生產線已回復正常量產。台積電日前在美國San Jose舉辦的
2016台積技術研討會中指出,預估今年總產能將成長逾10%,且幾乎集中在16奈米產能,
全年16奈米晶圓總出貨量將上看120萬片。
也就是說,台積電今年16奈米晶圓總出貨量將較去年成長逾一倍。
設備業者透露,3月以來,台積電16奈米產能已供不應求,除了蘋果A10應用處理器、賽靈
思可程式邏輯閘陣列(FPGA)等獨家代工訂單已開始投片量產,大陸IC設計龍頭海思的16
奈米Kirin手機晶片及網路處理器獨家代工訂單也在今年放量,加上聯發科16奈米新單下
半年量產投片,預期台積電今年16奈米供不應求情況將延續到下半年。
事實上,台積電原本預期16奈米16FFC製程將在第三季量產,但可望提前4月進入量產階段
,提前爭取到中低階智慧型手機、穿戴裝置、物聯網等應用晶片訂單並開始放量投片。
另外一個讓台積電決定加快16奈米擴產的新需求,來自於當紅的汽車電子。去年以來國際
車廠積極在新車款中搭載先進駕駛輔助系統(ADAS),由於許多新晶片將採用16奈米製程
生產,台積電已加快車用晶片製程的ISO26262及AEC-Q100 Grade 1等認證,同時提供更完
整的矽智財組合,預估明年中就可以提供完整的16奈米車聯網及ADAS晶片代工服務。
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