[請益] 關於製程工程師未來的發展
最近剛畢業在找工作
找的不外乎都是製程工程師
製程有分 薄膜 蝕刻 微影 擴散
大家都知道蝕刻和微影都很操(賽?)
一直有一個疑問 就是如果不分工作的loading
那這四大製程未來的發展(轉職)差在哪?
如果在蝕刻部門工作五年 之後要跳槽的話
是否只能往蝕刻領域跳槽(外商vendor 製程)?
還是學了製程的那套SOP 通常也很容易往其他製程領域跳?
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