[認真] 幫忙下載論文(送500P)
可以請淡江的各位大大幫忙下載論文嗎？
送上微薄的500P
1.
Multi-Step Cure Process for Void-Free Silicone Resin Encapsulant
Authors: Song, Min-Jae; Kim, Kwon-Hee; Yoon, Gil-Sang; Kim, Heung-Kyu
Source: Advanced Science Letters, Volume 13, Number 1, June 2012 , pp.
126-131(6)
Publisher: American Scientific Publishers
2.
FE Analysis of Cure-Process-Induced Residual Stress in Light Emitting Diode
Encapsulant Silicone Resin Considering Mechanical Property Evolution
Authors: Song, Min-Jae; Kim, Kwon-Hee; Kang, Jeong Jin; Yoon, Gil-Sang; Kim,
Heung-Kyu
Source: Advanced Science Letters, Volume 19, Number 12, December 2013 , pp.
3433-3440(8)
Publisher: American Scientific Publishers
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◆ From: 123.192.202.185
※ 編輯: tothat 來自: 123.192.202.185 (08/20 16:34)