[亞洲] 日本 半導體 product engineer已刪文

看板Oversea_Job作者時間6年前 (2019/07/18 05:26), 編輯推噓1(100)
留言1則, 1人參與, 6年前最新討論串1/1
這是全新的組,工作地點應該是在名古屋,請在面試時問一下。 請準備英文履歷,寄信給我。 ——————————————————————— Title: Product Engineer Description Owner of assigned products Participate in product definition and provide DFM inputs. Lead product introduction and ramp-up for image sensors and ASIC devices. Analyze yield and drive corrective actions for yield improvements. Drive characterization to finalize the product datasheet. Co-work with testing engineers to develop, verify and release testing program at CP or FT. Preferred- Some product engineering experience in image sensor or memory (flash, SRAM, DRAM) or ASIC products. Familiarity with silicon process will be plus. Good communication and organizational skills Strong analytical and problem solving skills. Master's Degree in EE or Physics, or a related field. EOE/Minorities/Females/Vet/Disability -- ※ 發信站: 批踢踢實業坊(ptt.cc), 來自: 166.170.43.244 (美國) ※ 文章網址: https://www.ptt.cc/bbs/Oversea_Job/M.1563398762.A.C52.html

07/18 11:53, 6年前 , 1F
感覺我可以耶,哈哈
07/18 11:53, 1F
文章代碼(AID): #1TBv9gnI (Oversea_Job)